The Offering Circular of LAIWU HIGH-TECH INVESTMENT HOLDINGS CO., LTD. CNY449,000,000 6.5 per cent. Bonds due 2029

公告日期：2026/05/04 · 栏目：发行公告

公告链接：https://atta.cmox.mo/disclosure/20260429/2049361296926228481/14143836.pdf